动态烷氧基胺共价键结构的晶圆临时键合材料

卢基 存*
光华临港工程应用技术研发（上海）有限公司

摘要


通过临时键合对晶圆和基板进行减薄处理是一种关键技术手段，被广泛应用于如玻璃通孔（TGV）等先进
封装工艺中。基于光引发剂 2959和氮氧自由基哌啶醇（H-TEMPO），通过化学合成得到了同时具有光敏基团和动态
烷氧基胺共价键结构的化合物。对固化后得到的临时键合材料分别进行光降解与热降解测试，分析其对紫外光与热
的敏感性。同时通过对比样测试，解释并阐述了热降解机理

关键词


临时键合；动态烷氧基胺共价键；降解材料

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参考


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DOI: http://dx.doi.org/10.12361/2661-3654-06-09-138703

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